Customization: | Available |
---|---|
Bonding Function: | Liquid Sealing Leak |
Morphology: | Solvent |
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Base
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Polyurethane
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Consistency
|
Stable Foam
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Curing System
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Moisture-cure
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Operating Temperature
|
5-35°C
|
Optimum operating temperature
|
18-25°C
|
Tack-Free Time (min)
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5-8 ( under conditions 10°C )
|
expansion ratio
|
89 times
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Cutting Time(min)
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40-55 ( under conditions 10°C )
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Density
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11.1kg/m
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Tensile Adhesive Strength
|
≥50KPA
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Temperature Resistance
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-5 °C ---+70 °C
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Insulation Factor(Mw/m.k)
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<20
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Compressive Strength(kPa)
|
>180
|
Water Absorption (ML)
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0.3~8(no epidermis) < 0.1 (with epidermis)
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